How Laser Wafer Dicing Can Help Semiconductor Companies?

Posted 2 years ago in TECHNOLOGY.

A new process for laser wafer dicing combines plasma etching and ablation. Both processes do not depend on the crystal structure of the wafer, so plasma dicing can be used to create patterns in thin silicon wafers.

How Laser Wafer Dicing Can Help Semiconductor Companies?

The dedicated laser dicing tool from Xsil was first displayed at the Semicon Japan tradeshow in December last year, and it is now available in the U.S., Europe, and Asia. However, the technology has remained elusive for most semiconductor manufacturers. Let's look at how laser wafer dicing can help semiconductor companies. And finally, let's look at the costs of laser wafer dicing.

Xsil's laser wafer dicing tool

Xsil's dedicated laser wafer dicing tool was first revealed at the Semicon Japan tradeshow in December. It is now available for purchase in the U.S., Europe, and Asia. The tool has several unique features, including a patented design that allows it to operate in the presence of moisture. Xsil's laser wafer dicing tool uses a pulsed Nd-YAG laser to etch defect regions of 10 um width. The laser beam is focused at various depths on the wafer, creating multiple images of the defect planes.

Thin silicon wafers are becoming more important to chip manufacturers than ever. In addition to being more important than ever, chip makers are also concerned about achieving high CoO. Due to the increasing demands placed on thin wafers, current methods of dicing are under pressure due to lower yields and throughput. Xsil's laser wafer dicing tool provides manufacturers with higher throughput, yield, and low consumable costs, which translates to increased return on capital investments.

IR, green, UV, or hi power lasers

Depending on the application, high-power IR, green, or UV lasers are used to cut semiconductor wafers. High-power IR lasers are generally more expensive, and require a higher pulse repetition rate for cutting bridges. Hi-power UV lasers are more efficient at dicing because they are less expensive. IR, green, or UV lasers are also available for dicing.

Hi-power lasers can cut SiC with little or no thermal damage. They generate no mechanical or electrical damage to the wafer, which minimizes contamination. They also maintain a water film on the wafer's surface during the process, which acts as a protective layer. It also prevents particles from deposition on the wafer surface during cutting. IR, green, and UV lasers are the best options for wafer dicing.

ED series: ED series lasers are compact and highly effective. They can be used for a wide range of processes, such as plastic welding and soldering. These lasers come with air or water cooling systems. This means they are compatible with most dicing applications. You can choose from various ED series lasers depending on your specific needs. They come in different wavelengths, pulse repetition rates, and power levels.

Plasma dicing

A new process for laser wafer dicing combines plasma etching and ablation. Both processes do not depend on the crystal structure of the wafer, so plasma dicing can be used to create patterns in thin silicon wafers. The unprotected area is exposed to high-density plasma and etched through later. A detailed micrograph of the cleavage plane is shown in the figure.

The main advantages of plasma dicing over laser and blade dicing include higher break strength and a lack of heat-affected zones. Additionally, plasma dicing can provide mechanical integrity to die subject to physical stress. This makes it a superior process for creating high-bandwidth memory chips and hybrid bonding stacks. But there are some limitations to plasma dicing. It may not be suited for all applications, and some manufacturers are hesitant to make the investment.

Plasma dicing is particularly attractive for fragile devices, such as MEMS (micro-electro-mechanical systems) and inertial sensors. These components are often sensitive to physical forces and do not respond well to mechanical dicing. The clean, non-mechanical singulation offered by plasma dicing is especially beneficial for such devices. The etching quality is excellent, although the cost is significantly higher than other dicing methods.

Cost of laser wafer dicing

Laser wafer dicing is the process of separating a single semiconductor chip from a larger wafer. Dicing machines use lasers and blades to cut the wafer into individual semiconductor chips. This process is more expensive than the blade saw method, but the final result is far better. Laser dicing also uses a high-speed dry process, which helps reduce kerf loss. The cost of laser wafer dicing varies, so you should ask about this when comparing dicing equipment.

The cost of laser wafer dicing machines depends on the types of dicing that you require. You can find a high-quality system by shopping around for a company that specializes in this process. For instance, the BlackStar laser wafer dicing machine uses a high-power, Fantom-Width Laser Dicing Technology to split materials at a molecular level. The process is designed for high-speed dicing with high edge quality, and reduces hazards for power-hungry RF microdevices.

Zac Efron

Living in United States

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